Samsung Starts Mass Production Of ‘World’s Fastest’ 4 GB DRAM Tapping New HBM Interface

Samsung heralds the new generation of memory chips, as it officially announced that it started volume manufacturing of High Bandwidth Memory (HBM2) packages. The 3D TSV DRAM technology has the means to impact both the gaming and enterprise sector. …read more

Source:: TechTimes.com – Computers