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December 7, 2015 Allura Alforsdotter Visited 156 times , 1 Visits today

Samsung Galaxy S7 To Boast Heat Pipe To Avoid Overheating Issues, Could Pack Snapdragon 820

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Samsung Galaxy S7 To Boast Heat Pipe To Avoid Overheating Issues, Could Pack Snapdragon 820

Samsung reportedly started testing various heat pipes for its next-generation Galaxy S7, indicating that it could return to Qualcomm processors. The extra precaution would ensure the Snapdragon 820 doesn’t overheat like the Snapdragon 810. …read more

Source:: TechTimes.com – Smartphones

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