Browse: Home » Gadgets » Samsung Galaxy S7 To Boast Heat Pipe To Avoid Overheating Issues, Could Pack Snapdragon 820
December 7, 2015 Allura Alforsdotter Visited 152 times , 1 Visits today

Samsung Galaxy S7 To Boast Heat Pipe To Avoid Overheating Issues, Could Pack Snapdragon 820

Cell Phones8050
Samsung Galaxy S7 To Boast Heat Pipe To Avoid Overheating Issues, Could Pack Snapdragon 820

Samsung reportedly started testing various heat pipes for its next-generation Galaxy S7, indicating that it could return to Qualcomm processors. The extra precaution would ensure the Snapdragon 820 doesn’t overheat like the Snapdragon 810. …read more

Source:: TechTimes.com – Smartphones

Filed under:
Google Chromebook Now Owns Over 50 Percent Of Educational Tech Market Share In US Previous post Google Chromebook Now Owns Over 50 Percent Of Educational Tech Market Share In US SevenHugs Smart Remotes Controls Devices By Just Pointing Next post SevenHugs Smart Remotes Controls Devices By Just Pointing