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Apple Wants A Slimmer iPhone 7 And Will Reportedly Use Fan-Out Packaging Technology

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Apple Wants A Slimmer iPhone 7 And Will Reportedly Use Fan-Out Packaging Technology

Rumors claim that Apple will be using fan-out packaging technology to make the iPhone 7 even thinner and lighter compared to the iPhone 6s. Apple is said to be the first smartphone manufacturer that will be applying the technology. …read more

Source:: TechTimes.com – Smartphones

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